Description
RELIFE BGA FLUX PASTE RL-420-UV
The RELIFE BGA FLUX PASTE RL-420-UV is a type of flux paste used in electronics manufacturing for the reflow soldering of Ball Grid Array (BGA) components. The specific content of the paste may vary depending on the manufacturer and formulation, but it typically contains a combination of rosin, activators, solvents, and other additives.
The exact composition of the paste is usually not disclosed by the manufacturer, as it may be considered a trade secret. However, the paste is designed to have good wetting and fluxing properties to facilitate the soldering of BGA components onto printed circuit boards (PCBs). It is also designed to be UV-curable, which means that it can be cured using UV light after application to the PCB.
Reviews
There are no reviews yet.