Description
Relife Reballing Fixture RL-601R Middle Layer Tin Planting Steel Mesh Tinning Platform 10in1 Set BGA
The Relife Reballing Fixture RL-601R Middle Layer Tin Planting Steel Mesh Tinning Platform 10in1 Set BGA??typically includes the following content: A base plate: This is a flat metal plate with several cutouts that allow the user to attach different-sized stencil plates to the fixture.
Stencil plates: The set usually includes 10 stencil plates of various sizes that are used to reball BGA chips. These plates have pre-cut holes that correspond to the balls on the chip.
A heating platform: This is a metal platform that sits on top of the base plate and is used to heat the BGA chip during the reballing process.
Tweezers: The set typically includes a pair of tweezers that are used to pick up and place the BGA chip onto the stencil plate.
A soldering iron: The set may include a soldering iron that is used to apply solder paste to the BGA chip.
A scraper: This is a small tool used to remove excess solder paste from the stencil plate.
A brush: A small brush is often included to help clean the stencil plate after use.
Flux: The set may also include flux, which is used to help the solder paste adhere to the BGA chip.
Solder balls: The set may include a small amount of solder balls, which are used to reball the BGA chip.
User manual: A user manual is typically included in the set to provide instructions on how to use the fixture and perform the reballing process.
Note that the exact contents of the set may vary depending on the manufacturer and supplier.
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